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Internal Stress of Thin Film
Stress in Cu Metalization during Deposition and Room-Temperature Aging
English
166 b
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Stress is a very important parameter which determines the reliability and life-time of thin film. Over 60% rejection of the electronic devices is due to stress failure. Stress can play an important role in the electrodeposited film as recrystallization can occur over times from several minutes to several years after electrodeposition. A critical analysis on the theoretical formulations and models of internal stress are reviewed in this book. A details literature of internal stress and it's co-relation with deposition parameters are included in this book. The work was mainly focused on the real time stress change of the electrodeposited Cu film during deposition and room temperature aging. In this book, different set-up for the measurement of in-situ and real time stress of electrodeposited films are discussed.
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