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Introduction to Microsystem Packaging Technology

Language EnglishEnglish
Book Hardback
Book Introduction to Microsystem Packaging Technology Jing Chen
Libristo code: 06699473
Publishers Taylor & Francis Inc, September 2010
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced s... Full description
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Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.

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About the book

Full name Introduction to Microsystem Packaging Technology
Author Jing Chen
Language English
Binding Book - Hardback
Date of issue 2010
Number of pages 232
EAN 9781439819104
ISBN 9781439819104
Libristo code 06699473
Publishers Taylor & Francis Inc
Weight 574
Dimensions 253 x 180 x 19

Categories

Technology, Engineering, Agriculture > Industrial chemistry & manufacturing technologies > Other manufacturing technologies
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