Contact
How to shop
Delivery
Shopping guide
Modeling and Simulation for Microelectronic Packaging Assembly
Manufacturing, Reliability and Testing
English
338 b
30-day return policy
Customers also purchased
/
Paperback
87.21
€
Teaches the skills needed to shorten the time for design, manufacturing, reliability, and testing of microelectronic package assembly§Liu and Liu begin with an overview of mechanics and modeling, including modeling validation tools and an explanation of concurrent engineering. They then move on to modeling in microelectronic packaging and assembly, coving packaging and assembly for typical ICs, optoelectronics, MEMS, SIP/3D, and nano interconnects. The next section explains modeling methods for package reliability and test, followed my modern modeling and simulation methodologies.§Models and simulates numerous processes in manufacturing, reliability and testing for the first time§Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing§Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products.§Subroutines and color images available for download from the books Companion Site
About the book
English
Give this book today
It's easy
1 Add to cart and choose Deliver as present at the checkout 2 We'll send you a voucher 3 The book will arrive at the recipient's addressYou might also be interested in
/
Paperback
138.20
€
/
Adobe ePub DRM
45.01
€
/
Paperback
35.71
€
/
Paperback
85.69
€
/
Paperback
25.99
€